CEO of Doctech Dr. Huang's presentation on the "Application of Novel Hybrid Nanotwin Copper in RDL Process." Doctech has developed a new patented hybrid nanotwin copper electroplating solution capable of producing Hybrid Nanotwin Copper (Hnt-Cu) and Nano-Crystalline Copper (nc-Cu). This electroplating solution, applied in various process structures like RDL/TSV/Interconnect/Pillars, achieves proper grain structures by controlling additive formulations to meet challenges in FOWLP, including requirements for low down to 2 µm linewidth, improved mechanical reliability, enhanced filling performance, and reduced manufacturing costs. The composite nanotwin copper structure is crucial for future copper bonding technology. Both Hnt-Cu and nc-Cu materials facilitate low-temperature direct copper-copper bonding, promoting stable pore-free interfaces to address key issues in IC packaging such as Electromigration (EM) and Thermal Migration (TM) in M3D.
Doctech offers a series of nanotwin copper products for emerging electronic packaging technologies, meeting demands for high thermal stability, superior mechanical performance, and chemical resistance. The developed nanotwin copper products are of excellent quality, suitable for future high-end semiconductor component materials, and can be produced according to customer requirements with the highest purity standards. Currently, they are actively collaborating with semiconductor packaging manufacturers and panel industries to validate the product's capabilities in new high-end technologies and are committed to bringing innovative technology to the IC packaging industry in line with future process trends.
